The invention relates to a device (100) and method (100) for the laser-supported machining of a workpiece (2) made of glass-based material, in particular for introducing damage into the workpiece (2), said device being configured to arrange the workpiece in the machining plane (W), with an ultra-short pulse laser (3), the focus region (1) of which lies at least partially within the workpiece and in which the irradiation intensity is so great that in the operating state, x-ray radiation is emitted from the focus region (1) in an energy range EM which is dependent on the composition of the workpiece. The focus region (1) is surrounded, at least in regions, by at least one shielding element (300, 310) for x-ray radiation, and thus provides a machining space (302). The shielding element (300, 310) comprises a material which has an x-ray absorption which is adapted to the energy range EM, in particular the material of the shielding element has a particularly high x-ray absorption in the energy range EM.
- 출원번호 : EP2024/077092
- 출원인 : SCHOTT AG
- 특허번호 :
- IPC : B23K-026/0622(2014.01);B23K-026/06(2014.01);B23K-026/382(2014.01);B23K-026/384(2014.01);B23K-026/386(2014.01);B23K-026/402(2014.01);B23K-026/70(2014.01);H05G-002/00(2006.01);B23K-103/00(2006.01);