Provided are a radio-frequency apparatus, a radio-frequency transmission system, a radio-frequency system, a radio-frequency module, and a radar. The radio-frequency apparatus comprises a packaging body (11) in which an IC bare die is packaged, and a PCB (21), wherein on the surface of the packaging body (11), at least one radiation sheet (119) and a plurality of solder balls (12), which are respectively arranged around each radiation sheet into a circle and form a waveguide channel, are provided, and an inner ring enclosed by the plurality of solder balls (12) comprises at least one ridge portion (121), which protrudes towards the inside of the ring; and the PCB (21) is provided with a first waveguide hole (211), which has the same shape as the inner ring enclosed by the solder balls (12). The radio-frequency transmission system further comprises a waveguide structure (22), which is arranged on the side of the PCB (21) that is away from the packaging body (11), wherein the waveguide structure (22) is provided with a ridge-shaped or rectangular second waveguide hole (221). The radio-frequency apparatus reduces the area occupied by a packaging transition structure, the radio-frequency transmission system realizes the diversification of a radio-frequency signal transmission channel, and the radio-frequency module reduces the loss.
- 출원번호 : CN2024/114349
- 출원인 : CALTERAH SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO., LTD.
- 특허번호 :
- IPC : H01L-023/66(2006.01);H01L-023/31(2006.01);H01Q-001/22(2006.01);H01P-003/123(2006.01);